Secretariat of A-SSCC2008
c/o ICS Convention Design, Inc.
Sumitomo Corp. Jinbocho Bldg., 3-24, kanda-Nishikicho,
Chiyoda-ku, Tokyo 101-8449, Japan
Tel : +81-3-3219-3541
Fax : +81-3-3292-1811

Final Paper Submission

It is now REQUIRED that all PDF submissions be IEEE Xplore compliant. If your file does not meet Xplore compliance, it will NOT be published and will be removed from the A-SSCC 2008 Proceedings CDROM and the IEEE Xplore system. To help you meet these new requirements, you must FIRST check to ensure that your PDF file is compliant by using the IEEE PDF eXpress system BEFORE you submit your paper on the conference final submission web site.

IMPORTANT PROCEDURE for Final Paper Submission

  1. Please proceed to the IEEE PDF eXpress web site which was provided to each author by e-mail with paper decision notification.
  2.  Click “New Users - click here”. Enter the Conference ID, your email address, and choose a new password. Continue to enter information as prompted. You will receive an email confirming the successful creation of your account.
  3.  Submit your PDF file for compliance checking. You will receive an email with the results shortly after file checking is complete. If your PDF failed compliance, you can either follow the instructions on the PDF eXpress web site to generate a good PDF file, OR you can submit your source file and the PDF eXpress system can generate a compliant PDF file for you, and will email you the resulting good PDF file.
  4. Once you have a GOOD PDF file, please return to this page and upload your final submission from the button below.

Please keep in mind that checking your PDF file for compliance and submitting your final paper for publication are 2 separate procedures.


After you have finished using the IEEE PDF eXpress system to either check your file for compliance or to generate a compliant file, MAKE SURE to return to this page and upload your compliant final submission.


Please refer to "Writing a good ISSCC paper"

Simplified Requirements for Creating PDF files for IEEE Xplore.
Paper template (PDF)


IEEE Copyright transfer

Authors should submit the IEEE Copyright form to the Conference Secretariat
(e-mail, Fax: +81-3-3292-1811)
when submitting their final papers.

Copy right Form (PDF)
Copy right Form (MS Word file)



Final Paper Submission

Please login with your ID and Password which was informed to each author by e-mail.

Important dates

June 9, 2008, 20:00 (GMT) Paper submission deadline
July 25, 2008 Acceptance notification 
August 29, 2008 Deadline for final papers submission
August 29, 2008 Author registration deadline


Call for papers

The IEEE A-SSCC 2008 (Asian Solid-State Circuits Conference) is an international forum for presenting the most updated and advanced chips and circuit designs in solid-state semiconductor fields. The conference is supported by the IEEE Solid-State Circuits Society and is held in Asia every year. Papers are solicited in the following categories:

Regular Sessions

  1. Analog Circuits & Systems: Amplifiers, comparators, switch capacitor circuits, continuous-time & discrete-time filters, voltage/current references; DC-DC converters, power-control circuits, linear regulators; IF/baseband analog circuits, AGC/VGA; display driver circuits; non-linear analog circuits.
  2. Data Converters: Nyquist-rate and oversampling A/D and D/A converters, sub-circuits for data converters including sample-and-hold circuits, calibration circuits.
  3. Digital Circuits & Systems: Design, fabrication, and test of digital VLSI systems; High-speed low-power digital circuits, power-reduction and management methods for digital VLSI, leakage reduction techniques; clock distribution, I/O circuits, reconfigurable logic-array circuits; supply /substrate noise measurement and cancellation for digital VLSI, variation and fault-tolerant circuits.
  4. SoC & Signal Processing Systems: System-on-chip, microprocessors, network processors, baseband communication processing system & architectures, low-power signal-processing systems; multimedia processors including video, image, audio and voice processing systems; cryptographic- and security-processing circuits and systems; bio-medical/neural signal processors.
  5. RF: Receivers/transmitters/transceivers for wireless systems; narrowband RF, ultra-wideband and millimeter-wave circuits (MMDS, 60GHz); Circuits and sub-circuits for RF front-end, LNA, mixer, power amplifiers, VCOs, frequency synthesizers, RF filters, RF switches, power detectors, active antennas.
  6. Wireline & Mixed-Signal Circuits: Receivers/transmitters/transceivers for wireline systems including (but not limited to) LAN, WAN, FDDI, Ethernet, token-ring, fiber channel, SONET, SDH, PON, ATM, ISDN, xDSL, cable-modem; optical/electrical data links and backplane transceivers; power-line communication; Clock generation circuits, PLL, DLL, spread-spectrum clock generation.
  7. Emerging Technologies and Applications: Advanced circuit technologies and techniques; ultra-low-voltage and sub-threshold logic design; molecular-, organic-, and nano-electronics; flexible substrates and printable electronics; 3D-integration and novel packaging technologies; compound-semiconductor, superconductive, and micro-photonic technologies and circuits; energy sources and energy harvesting; biomedical and ambient-intelligence; emerging wireless applications and circuits; RFID; analog and optical processors, non-transistor-based analog and digital circuits and systems; advanced memory technologies; spintronics; and quantum storage.
  8. Memory: Static, dynamic, non-volatile, and read-only memory; magnetic and ferro-electric memory designs and architectures; data storage and multi-bit-cell-based memory designs; embedded memory architectures, cache-memory systems, multi-port memory, and CAM designs, nano-crystal, phase-change, and 3D memories; yield-enhancement redundancy and ECC techniques; and memory testing and built-in self-test.

Special Sessions

  1. Industry Program: This special category accepts only papers based on state-of-the-art products. The paper may cover specifications, applications, state-of-the-art points, chip photos, chip architecture/software, circuits (not necessarily very original, significant improvement is fine), live demo if any, characterization results, and packaging/testing results.
  2. Student Design Contest: A student design contest is held among the accepted papers with system prototypes or measurement results of which operations can be demonstrated on-site. Refer to the web for further information.

Papers on low-power and/or low-voltage approaches, signal integrity, noise, test, and manufacturability for all the above categories are welcomed. Measurement results are highly recommended, especially for analog, and RF categories. Design methodologies for SiP, SoC, interconnections and statistical design are included in the scope of the conference; the papers only describing CAD tools and CAD algorithms are not considered. Dual submission to other conferences is not allowed. A special issue of the IEEE Journal of Solid-State Circuits will be prepared for publication of the outstanding papers of this conference.


First Call for Papers (pdf)
Second Call for papers (pdf)
Third Call for papers (pdf)