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IEEE Asian Solid-State Circuits Conference, Welcome to Taiwan
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Regular Session
1. Analog Circuits & Systems
Amplifiers, comparators, switch capacitor circuits, continuous-time & discrete-time filters, voltage/current references; DC-DC converters, power-control circuits; IF/baseband analog circuits, AGC/VGA; display driver circuits; non-linear analog circuits.

2. Data Converters
Nyquist-rate and oversampling A/D and D/A converters, sub-circuits for data converters including sample-and-hold circuits, calibration circuits.

3. Digital Circuits & Systems
Design, fabrication, and test of digital VLSI systems; High-speed low-power digital circuits, power-reduction and management methods for digital VLSI, leakage reduction techniques; clock distribution, I/O circuits, reconfigurable logic-array circuits; supply /substrate noise measurement and cancellation for digital VLSI, variation and fault-tolerant circuits.

4. SoC & Signal Processing Systems
System-on-chip, microprocessors, network processors, baseband communication processing system & architectures, low-power signal-processing systems; multimedia processors including video, image, audio and voice processing systems; cryptographic- and security-processing circuits and systems; bio-medical/neural signal processors.

5. RF
Receivers/transmitters/transceivers for wireless systems; narrowband RF, ultra-wideband and millimeter-wave circuits (MMDS, 60GHz); Circuits and sub-circuits for RF front-end, LNA, mixer, power amplifiers, VCOs, frequency synthesizers, RF filters, RF switches, power detectors, active antennas.

6. Wireline & Mixed-Signal Circuits
Receivers/transmitters/transceivers for wireline systems including (but not limited to) LAN, WAN, FDDI, Ethernet, token-ring, fiber channel, SONET, SDH, PON, ATM, ISDN, xDSL, cable-modem; optical/electrical data links and backplane transceivers; power-line communication; Clock generation circuits, PLL, DLL, spread-spectrum clock generation.

7. Emerging Technologies and Applications
Advanced circuit technologies and techniques; ultra-low-voltage and sub-threshold logic design; molecular-, organic-, and nano-electronics; flexible substrates and printable electronics; 3D-integration and novel packaging technologies; compound-semiconductor, superconductive, and micro-photonic technologies and circuits; energy sources and energy harvesting; biomedical and ambient-intelligence; emerging wireless applications and circuits; RFID; analog and optical processors, non-transistor-based analog and digital circuits and systems; advanced memory technologies; spintronics; and quantum storage.

8. Memory
Static, dynamic, non-volatile, and read-only memory; magnetic and ferro-electric memory designs and architectures; data storage and multi-bit-cell-based memory designs; embedded memory architectures, cache-memory systems, multi-port memory, and CAM designs, nano-crystal, phase-change, and 3D memories; yield-enhancement redundancy and ECC techniques; and memory testing and built-in self-test.

Special Session 
1. Industry Program
This special category accepts only papers based on state-of-the-art products. The paper may cover specifications, applications, state-of-the-art points, chip photos, chip architecture/software, circuits (not necessarily very original, significant improvement is fine), live demo if any, characterization results, and packaging/testing results.

2. Student Design Contest
A student design contest is held among the accepted papers with system prototypes or measurement results of which operations can be demonstrated on-site. Refer to the web for further information.

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