Analog Circuits and Systems
• Chair: Hidetoshi Onodera, Kyoto University (onodera@i.kyoto-u.ac.jp)
| • Member: |
Bill Yang Liu, Shanghai/Japan Design Center (bill.liu@analog.com)
Tsung-Hsien Lin, National Taiwan University (thlin@cc.ee.ntu.edu.tw)
Yasuhiro Sugimoto, Chuo University (sugimoto@sugi.elect.chuo-u.ac.jp)
Joongho Choi , University of Seoul (jchoi@uos.ac.kr)
Li Geng, Xi’an Jiaotong University (gengli@mail.xjtu.edu.cn)
Po-Chiun Hung, National Tsing Hua Univ., Taiwan (pchuang@ee.nthu.edu.tw)
Tetsuya Hirose, Kobe University ( hirose@eedept.kobe-u.ac.jp)
Seng-Pan U (Ben), University of Macau (benspu@ieee.org)
Jeongjin Roh, Hanyang University (jroh@hanyang.ac.kr)
Seung-Tak Ryu, KAIST (stryu@ee.kaist.ac.kr) |
Data Converter
• Chair: Kunihiko Iizuka, Sharp Corporation (iizuka.kunihiko@sharp.co.jp)
| • Member: |
Yuichi Okuda, Renesas Electronics Corp. (yuichi.okuda.yn@renesas.com)
Tai-Cheng Lee, National Taiwan University (tlee@cc.ee.ntu.edu.tw)
Seong Hwan Cho, KAIST (chosta@ee.kaist.ac.kr)
Zhongyuan Chang, Shanghai Belling (zchang@belling.com.cn)
Yong Moon, Soongsil university (moony@ssu.ac.kr)
Hung S. Li, Mediatek Inc. (hung.li@mediatek.com)
Koichi Ono, Sony corporation (Koichi.Ono@jp.sony.com)
Xu Yong Ping, National University of Singapore (yongpingxu@nus.edu.sg)
Soon-Jyh Chang, National Cheng-Kung University (soon@mail.ncku.edu.tw)
Kwang-Hyun Baek , Chung-Ang University (kbaek@cau.ac.kr) |
Digital Circuits & Systems
• Chair: Mototsugu Hamada, Toshiba Corporation (mototsugu.hamada@toshiba.co.jp)
| • Member: |
Makoto IKEDA, University of Tokyo (ikeda@silicon.u-tokyo.ac.jp)
Leibo LIU, Tsinghua University (liulb@tsinghua.edu.cn)
Fumio Arakawa, Renesas Electronics Corp. (fumio.arakawa.ym@renesas.com)
Chi-Cheng Ju, MediaTek Inc. (cc.ju@mediatek.com)
Kyeong-Sik Min, Kookmin University (mks@kookmin.ac.kr)
Utpal Desai, Intel Technology India Pvt. Ltd (Utpal.Desai@Intel.com)
Xiaoyang Zeng, Fudan University (xyzeng@fudan.edu.cn)
Chen-Yi Lee, National Chiao Tung University (cylee@si2lab.org)
Se-Joong Lee, Texas Instruments (sejoonglee@ti.com)
Philippe ROYANNEZ, ST-Ericsson Asia Pacific (philippe.royannez@gmail.com)
Seung Eun Lee, Seoul National University of Science & Technology (seung.lee@seoultech.ac.kr) |
Emerging Tech. and Applications
• Chair: Koji Kotani, Tohoku University (kotani@ecei.tohoku.ac.jp)
| • Member: |
Ali Keshavarzi, GLOBALFOUNDRIES (Ali.Keshavarzi@globalfoundries.com)
C. Patrick Yue, University of California (cpyue@ece.ucsb.edu)
Shuohung Hsu, National Tsinghua University (shhsu@ee.nthu.edu.tw)
Seungjun Lee, Ewha Womans University (slee@ewha.ac.kr)
Volkan Kursun , Hong Kong University (eekursun@ust.hk)
Reiji Hattori, Kyushu University (hattori@astec.kyushu-u.ac.jp)
Maryam Shojaei Baghini, Indian Institute of Technology (mshojaei@ee.iitb.ac.in)
Masaki Hirata, Ritsumeikan University (m-hirata@fc.ritsumei.ac.jp)
Paul Marchal, IMEC (marchal@imec.be)
Yusuke Kanno, Hitachi, Ltd. (yusuke.kanno.wy@hitachi.com)
Ilku Nam, Pusan National University (nik@pusan.ac.kr)
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Industry Subcommitee
• Chair: Stefan Rusu, Intel Corporation (stefan.rusu@intel.com)
Memory
• Chair: Kunwoo Park, Hynix Semiconductor Inc. (kunwoo.park@hynix.com)
| • Member: |
Ken Takeuchi, Tokyo University (takeuchi@lsi.t.u-tokyo.ac.jp)
Atsushi Kawasumi, Toshiba Corporation (atsushi.kawasumi@toshiba.co.jp)
Choi Sungdae, Hynix Semiconductor Inc. (sungdae.choi@hynix.com)
Katsuyuki Sato, TSMC (ksato@tsmc.com)
Kazuhiko Kajigaya, Elpida Memory Inc. (k.kajigaya.bf@elpida.com)
Meng-Fan Marvin Chang, National Tsing Hua University mfchang@ee.nthu.edu.tw()
Hiroyuki Yamauchi , Fukuoka Institute of Technology (yamauchi@fit.ac.jp)
Bor-Doou Rong, Etron Technology Inc. (bdrong@etron.com.tw)
Yufeng XIE, Fudan University, China (Xieyf@fudan.edu.cn )
Junghwan Choi, Samsung Electronics (junghwan.choi@samsung.com)
Kee-Won Kwon, Sungkyunkwan Univ. (keewkwon@gmail.com, keekwon@skku.edu)
Shiho Kim, Yonsei University (shiho@yonsei.ac.kr) |
RF
• Chair: Satoshi Tanaka, Renesas Electronics (satoshi.tanaka.sx@renesas.com)
| • Member: |
Shuya Kishimoto, NEC Corporation (kisimoto@bx.jp.nec.com)
Huei Wang, National Taiwan University (hueiwang@ntu.edu.tw)
Minoru Fujishima, University of Tokyo (fuji@k.u-tokyo.ac.jp)
Howard Luong, Hong Kong University (eeluong@ee.ust.hk)
Kang-Yoon Lee, Konkuk University (kylee@ konkuk.ac.kr)
Hyunchol Shin, Kwangwoon University (hshin@kw.ac.kr)
Chien-Nan Kuo, National Chao Tung University (cnkuo@mail.nctu.edu.tw)
Baoyong Chi, Tsinghua University (chibylxc@mail.tsinghua.edu.cn)
Julien Ryckaert, IMEC / SSET (julien.ryckaert@imec.be)
Shouhei Kousai, Toshiba (shouhei.kousai@toshiba.co.jp)
Chun Huat Heng, National University of Singapore
Tae Wook Kim, Yonsei University (taewook.kim@yonsei.ac.kr)
Ting-Ping Liu, Nuvoton Electronics Technology (tpliu@nuvoton.comr) |
SoC & Signal Processing
• Chair: Kazutami Arimoto, Renesas Electronics Corporation (kazutami.arimoto.jx@renesas.com)
| • Member: |
Byeong-Gyu Nam, Chungnam National University (byeonggyu.nam@gmail.com)
Zhiyi Yu, Fudan University (zhiyiyu@fudan.edu.cn)
Donghyun Kim, SAMSUNG TECHWIN (donghyun53@gmail.com)
Zhenyu Liu, Tsinghua University (liuzhenyu73@tsinghua.edu.cn)
Hirofumi Sumi, Sony Corporation (Hirofumi.Sumi@jp.sony.com)
Shao-Yi Chien, National Taiwan University (sychien@cc.ee.ntu.edu.tw)
Tomohisa Wada, University of the Ryukyus (wada@ie.u-ryukyu.ac.jp)
Robert Chen-Hao Chang, National Chung Hsing University (chchang@dragon.nchu.edu.tw)
Hsie-Chia Chang, National Chia Tung University (hcchang@mail.nctu.edu.tw)
Sugako Otani, Renesas Electronics Corporation (sugako.otani.uj@renesas.com) |
Wireline & Mixed-Signal Circuits
• Chair: Hong June Park, Pohang University of Science and Technology (hjpark@postech.ac.kr)
| • Member: |
Jaeha Kim, Seoul National University (jaeha@snu.ac.kr)
Woogeun Rhee, Tsinghua University (wrhee@tsinghua.edu.cn)
Jri Lee, National Taiwan University (jrilee@cc.ee.ntu.edu.tw)
Nan Sun, Uinversity of Texas (nansun@mail.utexas.edu)
Hiroyuki Okada, Renesas Electronics Corporation (hiroyuki.okada.jz@renesas.com)
Jongsun Kim, Hongik University (js.kim@hongik.ac.kr)
Yasushi HAYAKAWA, Renesas Electronics Corporation (yasushi.hayakawa.jz@renesas.com)
Wei-Zen Chen, National Chiao Tung University (wzchen@alab.ee.nctu.edu.tw)
Hiroki Ishikuro, Keio University (ishikuro@elec.keio.ac.jp)
In-Chul Hwang, Kangwon National University (ihwang@kangwon.ac.kr)
Tszshing CHEUNG, Fujitsu Lab. (cheung@jp.fujitsu.com) |
SDC
• Chair: Shiho Kim, Yonsei University (shiho@yonsei.ac.kr)
• Co-Chair: Masaki Hirata, Renesas Electronics Corporation (masaki.hirata.wj@renesas.com)
| • Member: |
Seungjun Lee, Ewha Womans University (slee@ewha.ac.kr)
Jongsun Kim, Hongik University (js.kim@hongik.ac.kr)
Tszshing Cheung, Fujitsu Laboratories Limited (cheung@jp.fujitsu.com)
Bill Yang Liu, Analog Devices Shanghai (bill.liu@analog.com)
Po-Chiun Huang, National Tsing Hua University (pchuang@ee.nthu.edu.tw)
Hirofumi Sumi, Sony Corporation (Hirofumi.Sumi@jp.sony.com)
Shao-Yi Chien, National Taiwan University (sychien@cc.ee.ntu.edu.tw)
Lebo Liu, Tsinghua University (liulb@tsinghua.edu.)
Chi-Cheng Ju, MediaTek Inc. (cc.ju@mediatek.com)
Kang-Yoon Lee, Konkuk University (kylee@ konkuk.ac.kr)
Julien Ryckaert, IMEC (julien.ryckaert@imec.be)
Yong Moon, Soongsil University (moony@ssu.ac.kr)
Hung S. Li, Mediatek, TW (hung.li@mediatek.com)
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