Technical Program Chair:Makoto Ikeda, the University of Tokyo, Japan
Technical Program Co-Chair:Deog‐KyoonJeong, Seoul National University, Korea
Technical Program Vice Chair:Noriyuki Miura, Kobe University, Japan
Technical Program Vice Co-Chair:Jaeha Kim, Seoul National University, Korea

Analog Circuits & Systems:Hidetoshi Onodera, Kyoto University, Japan
Data Converter:SeongHwan Cho, KAIST, Korea
Digital Circuits & Systems:Robert Chen‐Hao Chang, National Chi Nan University, Taiwan
SoC& Signal Processing:KazutamiArimoto, Okayama Prefectural University, Japan
RF:Satoshi Tanaka, Murata Manufacturing co., Japan
Wireline:Hong-June Park, POSTECH, Korea
Emerging Tech. and Applications: Woogeun Rhee, Tsinghua University, China
Memory: Kunwoo Park, SK hynix, Korea

Industry Program Chair:Stefan Rusu, Intel Corporation, USA
Invited Program Chair:Hoi-Jun Yoo, KAIST, Korea
Educational Program Co-Chair:Hoi-Jun Yoo, KAIST, Korea
Educational Program Co-Chair:Byeong‐Gyu Nam, ChungnamNational University, Korea
Student Design Contest Co-Chair:Ting-Ping Liu, Nokia, USA
Student Design Contest Co-Chair:Baoyong Chi, Tsinghua University, China

Chair:Hidetoshi Onodera, Kyoto University, Japan
Hao Yu,Nanyang Technological University, Singapore
Sai-Weng Sin, University of Macau, Macau
Seung-TakRyu, KAIST, Korea
Tetsuya Hirose, Kobe University, Japan
LiGeng, Xi'an Jiaoton University, China
Takeshi Ueno, Toshiba Corporation, Japan
Yung-Chow Peng, TSMC, Taiwan
Po-Chiun,National TsingHua University, Taiwan
Zhangming Zhu,Xidian University, China

Chair:Seong-Hwan Cho, KAIST, Korea
Jong-woo Lee,Samsung Electronics, Korea
Takeshi Yoshida, Hiroshima Univ., Japan
Masaya Miyahara, Tokyo Institute of Technology, Japan
Seng-Pan U,University of Macau, Macau
Liyuan Liu, Chinese Academy of Sciences, China
Tai-Cheng Lee,National Taiwan University, Taiwan
Tsung‐Heng Tsai,National Chung Cheng University, Taiwan
Yung‐Yu Lin,MediaTek, Taiwan
Gil‐Cho Ahn,Sogang University, Korea
Sanroku Tsukamoto,Fujitsu Laboratories Ltd., Japan

Chair:Robert Chen‐Hao Chang,National Chi Nan University, Taiwan
Gregory Chen,Intel, USA
Shu‐Yu Hsu,MediaTek, Taiwan
Byungsub Kim, POSTECH, Korea
VolkanKursun,HKUST, Hong Kong
Keiichi Kushida, Toshiba Corporation, Japan
Yong Lian, York University, Canada
Tay‐Jyi Lin,National Chung Cheng University, Taiwan
Leibo Liu, Tsinghua University, China
XiaoyangZeng, Fudan University, China
Dajiang Zhou, Waseda University, Japan

Chair:KazutamiArimoto, Okayama Prefectural Univ, Japan
Byeong-Gyu Nam,Chungnam National University, Korea
Chun Zhang,Tsinghua University, China
Kyung Ki Kim,Daegu University, Korea
Yong Hei,Chinese Academy of Sciences, China
Satoshi Shigematsu, NTT, Japan
An‐Yeu (Andy) Wu,National Taiwan University, Taiwan
Takeshi Kumaki,Ritsumeikan University, Japan
SugakoOtani,Renesas Electronics Corporation, Japan
Pei‐Yun Tsai, National Central University, Taiwan
Hongbin Sun,Xi’an Jiaotong University, China

Chair:Satoshi Tanaka, Murata Manufacturing co. , Japan
Huei Wang, National Taiwan University, Taiwan
Minoru Fujishima, Hiroshima University, Japan
Chien-Nan Kuo, National Chao Tung University, Taiwan
Baoyong Chi, Tsinghua University, China
DavideGuermandi,IMEC, Europe
Chun HuatHeng, National University of Singapore, Singapore
Tae Wook Kim,Yonsei University, Korea
Ting-Ping Liu,Nokia, USA
KaiKang,Univ. of Electronic Science and Technology of China, China

Chair:Hong June Park, POSTECH, Korea
Wei-Zen Chen,National Chiao‐Tung University, Taiwan
Jun Terada, NTT, Japan
Jung‐Hoon Chun,Sungkyunkwan University, Korea
Bo Zhang, Broadcom, USA
Ping‐Hsuan Hsieh, National Tsinghua University, Taiwan
Hyun‐Bae Lee,SK hynix Inc., Korea
Feng Zhang,Chinese Academy of Sciences, China
Patrick Yin Chiang,Fudan University,China
Takayuki Shibasaki,Fujitsu Laboratories Ltd., Japan

Chair:Woogeun Rhee, Tsinghua University, China
Jerald Yoo,Masdar Institute of Science and Technology, United Arab Emirates
Pui-In Mak, University of Macau, China
Minkyu Je,DaeguGyeongbuk Institute of Science and Technology, Korea
YoungcheolChae,Yonsei University, Korea
Hidekuni Takao,Kagawa University, Japan
Nan Sun,Uinversity of Texas at Austin, USA
Shuenn‐Yuh Lee,National Cheng‐Kung University, Taiwan
Masaitsu Nakajima,Socionext Inc., Japan
Chung‐Chih Hung,National Chiao Tung University, Taiwan
ShiroDosho,Tokyo Institute of Technology, Japan
Lianming Li,Southeast University, China

Chair:Kunwoo Park, SK hynix, Korea
Atsushi Kawasumi, Toshiba, Japan
Sungdae Choi,SK Hynix Semiconductor, Korea
HJ Liao, TSMC, Taiwan
KazutakaMiyano,Micron, Japan
Meng-FanChang, National TsingHua University, Taiwan
Chun Shiah,Etron, Taiwan
Junghwan Choi,Samsung Elec. Co., Korea
Ken Takeuchi, Chuo University, Japan
Tony T. Kim,Nanyang Technological University, Singapore
Jaydeep P. Kulkarni, Intel, USA

Chair:Stefan Rusu, Intel Corporation, USA
Toru Shimizu, Keio University, Japan
Kok Hong Chan,Altera, Malaysia
Kazuko Nishimura,Panasonic Corporation, Japan
Daisaburo Takashima,Toshiba Corp., Japan
ShaoJun Wei, Tsinghua University, China
Ting Wu,Norel Systems, China
Fan Yung Ma,Infineon, Singapore
Yi Kang,Spreadtrum Communications Inc., China