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Organization

Organizing Committee

Conference Chair

Yoichi Yano, Renesas Electronics, Japan (yoichi.yano@lm.renesas.com)
Yoichi Yano

Organizing Committee Chair

Toru Shimizu, Renesas Electronics, Japan (toru.shimizu.xn@renesas.com)
Toru Shimizu

Liaison of Steering Committee

Takayasu Sakurai, University of Tokyo, Japan (tsakurai@iis.u-tokyo.ac.jp)
Takayasu Sakurai

Treasurer

Makoto Ikeda, University of Tokyo, Japan (ikeda@silicon.t.u-tokyo.ac.jp)
Makoto Ikeda

Local Arrangements

Makoto Nagata, Kobe Univ., Japan (nagata@cs.kobe-u.ac.jp)
Makoto Nagata

Publications

Tetsuya Hirose, Kobe Univ., Japan (hirose@eedept.kobe-u.ac.jp)
Tetsuya Hirose
Toshiaki Machida, Renesas Electronics, Japan (toshiaki.machida.te@renesas.com)
Toshiaki Machida

Exhibit

Yuji Hatano, Renesas Electronics, Japan (yuji.hatano.fv@renesas.com)
Yuji Hatano

Secretary of Organizing Committee

Junji Ishikawa, Renesas Electronics, Japan (junji.ishikawa.jc@renesas.com)
Junji Ishikawa

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Steering Committee

Chairman

Takayasu Sakurai, University of Tokyo, Japan
Takayasu Sakurai

Secretary of General Affairs

Tzi-Dar Chiueh, NTU, Taiwan

Secretary of Technical Program

Makoto Ikeda, University of Tokyo, Japan

International Liaison Members

Anantha Chandrakasan, Massachusetts Institute of Technology, USA
Willy Sansen, Katholieke University, Belgium

Members

Biswadip (Bobby) Mitra, Texas Instruments, India
Deong-Kyoon Jeong, Seoul National University, Korea
Genda Hu, FocalTech Systems, Taiwan
Hoi-Jun Yoo, Korea Advanced Institute of Science and Technology, Korea
Jyuo-Ming Shyu, National Tsing Hua University, Taiwan
Masao Nakaya, Semiconductor Technology Academic Research Center, Japan
Kiyoo Itoh, Hitachi Central Research, Japan
Kunihiro Asada, University of Tokyo, Japan
Mark Liu, Taiwan Semiconductor Manufacturing Company Ltd., Taiwan
Nam-Sung Woo, Samsung Electronics, Korea
Nicky Lu, Etron Technology, Inc., Taiwan
Takayasu Sakurai, University of Tokyo, Japan
Zhihua Wang, Tsinghua University, China

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Technical Program Committee

Technical Program Chair

Chang-Hyun Kim, Samsung Electro-Mechanics Co., Korea (chang.kim@samsung.com)
Chang-Hyun Kim

Technical Program Co-Chair

Zhihua Wang, Tsinghua Univ., China (zhihua@tsinghua.edu.cn)
Zhihua Wang

Technical Program Vice-Chair

Hong-June Park, POSTECH, Korea (hjpark@postech.ac.kr)
Hong-June Park

Sub-committee Chair

Analog Circuits & Systems Chair

Hidetoshi Onodera, Kyoto University (onodera@i.kyoto-u.ac.jp)
Hidetoshi Onodera

Data Converter Chair

Seong Hwan Cho, KAIST (chosta@ee.kaist.ac.kr)
Seong Hwan Cho

Digital Circuits & Systems Chair

Mototsugu Hamada, Toshiba Corporation (mototsugu.hamada@toshiba.co.jp)
Mototsugu Hamada

Emerging Tech. and Applications (ETA) Chair

Tzi-Dar Chiueh, National Taiwan University (chiueh@cc.ee.ntu.edu.tw)
Tzi-Dar Chiueh

Industry Subcommittee Chair

Stefan Rusu, Intel Corporation (stefan.rusu@intel.com)
Stefan Rusu

Memory Chair
Kunwoo Park, SKhynix Semiconductor Inc. (kunwoo.park@hynix.com)
RF Chair

Satoshi Tanaka, Murata Manufacturing (satoshi.tanaka.sx@murata.co.jp)
Satoshi Tanaka

SoC & Signal Processing Chair

Kazutami Arimoto, Okayama Prefectural University (arimoto@cse.oka-pu.ac.jp)
Kazutami Arimoto

Wireline & Mixed-Signal Circuits Chair
Woogeun Rhee, Tsinghua University (wrhee@tsinghua.edu.cn)
Woogeun Rhee
Student Design Contest (SDC) Chair

Shiho Kim, Yonsei University (shiho@yonsei.ac.kr)
Shiho Kim

TPC Sub-committee

Analog Circuits & Systems

Chair

Hidetoshi Onodera, Kyoto University (onodera@i.kyoto-u.ac.jp)

Member

Li Geng, Xi'an Jiaoton University (gengli@mail.xjtu.edu.cn)
Tetsuya Hirose, Kobe University (hirose@eedept.kobe-u.ac.jp)
Po-Chiun Huang, National Tsing Hua University (pchuang@ee.nthu.edu.tw)
Bill Yang Liu, Analog Devices Shanghai (bill.liu@analog.com)
Yung-Chow Peng, TSMC (ycpengk@tsmc.com)
Jeongjin Roh, Hanyang University (jroh@hanyang.ac.kr)
Seung-Tak Ryu, KAIST (stryu@ee.kaist.ac.kr)
Yasuhiro Sugimoto, Chuo University (sugimoto@sugi.elect.chuo-u.ac.jp)
Seng-Pan U, SYNOPSYS-CHIPIDEA Microelectronics, University of Macau (benspu@ieee.org)

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Data Converter

Chair
Seong Hwan Cho, KAIST (chosta@ee.kaist.ac.kr)
Member
Soon-Jyh Chang, National Cheng-Kung University (soon@mail.ncku.edu.tw)
Zhongyuan Chang, Shanghai Belling (zchang@belling.com.cn)
Tai-Cheng Lee, National Taiwan University (tlee@cc.ee.ntu.edu.tw)
Hung S. Li, Mediatek Inc. (hung.li@mediatek.com)
Yong Moon, Soongsil University (moony@ssu.ac.kr)
Yuichi Okuda, Renesas Electronics Corp. (yuichi.okuda.yn@renesas.com)
Koichi Ono, Sony Corporation (Koichi.Ono@jp.sony.com)
Xu Yong Ping, National University of Singapore (yongpingxu@nus.edu.sg)
Takeshi Yoshida, Hiroshima University (tyoshida@dsl.hiroshima-u.ac.jp)
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Digital Circuits & Systems

Chair
Mototsugu Hamada, Toshiba Corporation (mototsugu.hamada@toshiba.co.jp)
Member
Utpal Desai, Intel Technology India Pvt. Ltd (Utpal.Desai@Intel.com)
Makoto Ikeda, University of Tokyo (ikeda@silicon.u-tokyo.ac.jp)
Chi-Cheng Ju, MediaTek Inc. (cc.ju@mediatek.com)
Keiichi Kushida, Toshiba Corporation (keiichi.kushida@toshiba.co.jp)
Chen-Yi Lee, National Chiao Tung University (cylee@si2lab.org)
Se-Joong Lee, Qualcomm (shocktop@gmail.com)
Leibo Liu, Tsinghua University, Beijing P.R.China (liulb@tsinghua.edu.cn)
Kyeong-Sik Min, Kookmin University(mks@kookmin.ac.kr)
Philippe Royannez, ST-Ericsson Asia Pacific (philippe.royannez@gmail.com)
Yasuhisa Shimazaki, Renesas Electronics Corp. (yasuhisa.shimazaki.xv@renesas.com)
Xiaoyang Zeng, Fudan University (xyzeng@fudan.edu.cn)
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Emerging Tech. and Applications (ETA)

Chair
Tzi-Dar Chiueh, National Taiwan University (chiueh@cc.ee.ntu.edu.tw)
Member
Maryam Shojaei Baghini, Indian Institute of Technology (mshojaei@ee.iitb.ac.in)
Reiji Hattori, Kyushu University (hattori@astec.kyushu-u.ac.jp)
Masaki Hirata, Ritsumeikan University (m-hirata@fc.ritsumei.ac.jp)
Shuohung Hsu, National Tsinghua University (shhsu@ee.nthu.edu.tw)
Ali Keshavarzi, GLOBALFOUNDRIES (Ali.Keshavarzi@globalfoundries.com)
Koji Kotani, Tohoku University (kotani@ecei.tohoku.ac.jp)
Volkan Kursun, Hong Kong University of Science and Technology (eekursun@ust.hk)
Seungjun Lee, Ewha Womans University (slee@ewha.ac.kr)
Jerald Yoo, Masdar Institute of Science and Technology (jyoo@masdar.ac.ae)
C. Patrick Yue, University of California, Santa Barbara (cpyue@ece.ucsb.edu)
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Industry Subcommittee

Chair
Stefan Rusu, Intel Corporation (stefan.rusu@intel.com)
Member
Ron Ho, Oracle (ron.ho@oracle.com)
Koji Kai, Panasonic Corporation (kai.kj@jp.panasonic.com)
Tadahiro Kuroda, Keio University (kuroda@elec.keio.ac.jp)
Kangmin Lee, Samsung Electronics Corporation (kangmin21.lee@samsung.com)
Toru Shimizu, Renesas Electronics Corporation (toru.shimizu.xn@renesas.com)
ShaoJun Wei, Tsinghua University (wsj@public3.bta.net.cn)
Ting Wu, Norel Systems Ltd. (ting.wu@norelsys.com)
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Memory

Chair
Kunwoo Park, SKhynix Semiconductor Inc. (kunwoo.park@hynix.com)
Member
Meng-Fan Marvin Chang, National Tsing Hua University (mfchang@ee.nthu.edu.tw)
Sungdae Choi, SKhynix Semiconductor Inc. (sungdae.ieee@gmail.com)
Junghwan Choi, Samsung Electronics Corporation (junghwan.choi@samsung.com)
Kazuhiko Kajigaya, Elpida Memory Inc. (k.kajigaya.bf@elpida.com)
Atsushi Kawasumi, Toshiba Corporation (atsushi.kawasumi@toshiba.co.jp)
Shiho Kim, Yonsei University (shiho@yonsei.ac.kr)
Bor-Doou Rong, Etron Technology Inc. (bdrong@etron.com.tw)
Katsuyuki Sato, TSMC (ksato@tsmc.com)
Ken Takeuchi, Chuo University (takeuchi@takeuchi-lab.org)
Hiroyuki Yamauchi, Fukuoka Institute of Technology (yamauchi@fit.ac.jp)
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RF

Chair
Satoshi Tanaka, Murata Manufacturing (satoshi.tanaka.sx@murata.co.jp)
Member
Baoyong Chi, Tsinghua University (chibylxc@mail.tsinghua.edu.cn)
Minoru Fujishima, Hiroshima University (fuji@hiroshima-u.ac.jp)
Chun Huat HENG, National University of Singapore (elehch@nus.edu.sg)
Tae Wook Kim, Yonsei University (taewook.kim@yonsei.ac.kr)
Shuya Kishimoto, NEC Corporation (kisimoto@bx.jp.nec.com)
Chien-Nan Kuo, National Chao Tung University (cnkuo@mail.nctu.edu.tw)
Ting-Ping Liu, Nuvoton Electronics Technology (Shanghai) (tpliu@ieee.org)
Howard Luong, Hong Kong University of Science & Technology (eeluong@ee.ust.hk)
Julien Ryckaert, IMEC / SSET (julien.ryckaert@imec.be)
Hyunchol Shin, Kwangwoon University (hshin@kw.ac.kr)
Huei Wang, National Taiwan University (hueiwang@ntu.edu.tw)
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SoC & Signal Processing

Chair
Kazutami Arimoto, Okayama Prefectural University (arimoto@cse.oka-pu.ac.jp))
Member
Robert Chen-Hao Chang, National Chung Hsing University (chchang@dragon.nchu.edu.tw)
Hsie-Chia Chang, National Chia Tung University (hcchang@mail.nctu.edu.tw)
Shao-Yi Chien, National Taiwan University (sychien@cc.ee.ntu.edu.tw)
Donghyun Kim, Samsung Techwin (donghyun53@gmail.com)
Zhenyu Liu, Tsinghua University (liuzhenyu73@tsinghua.edu.cn)
Byeong-Gyu Nam,Chungnam National University (byeonggyu.nam@gmail.com)
Sugako Otani, Renesas Electronics Corporation (sugako.otani.uj@renesas.com)
Hirofumi Sumi, Sony Corporation (Hirofumi.Sumi@jp.sony.com)
Tomohisa Wada, University of the Ryukyus (wada@ie.u-ryukyu.ac.jp)
Zhiyi Yu, Fudan University (zhiyiyu@fudan.edu.cn)
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Wireline & Mixed-Signal Circuits

Chair
Woogeun Rhee, Tsinghua University (wrhee@tsinghua.edu.cn)
Member
Wei-Zen Chen, National Chiao Tung University (wzchen@alab.ee.nctu.edu.tw)
Yasushi Hayakawa, Renesas Electronics Corporation (yasushi.hayakawa.jz@renesas.com)
Wei-Zen Chen, National Chiao Tung University (wzchen@alab.ee.nctu.edu.tw)
Masaya Kibune, Fujitsu Laboratories (kibune.masaya@jp.fujitsu.com)
Byungsub Kim, POSTECH (byungsub@postech.ac.kr)
Jaeha Kim, Seoul National University (jaeha@snu.ac.kr)
Jongsun Kim, Hongik University (js.kim@hongik.ac.kr)
Jri Lee, National Taiwan University (jrilee@cc.ee.ntu.edu.tw)
Yong Liu, IBM Watson Research Center (yongliu@us.ibm.com)
Hiroyuki Okada, Renesas Electronics Corporation (hiroyuki.okada.jz@renesas.com) Jun Terada, NTT (terada.jun@lab.ntt.co.jp)
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Student Design Contest (SDC)

Chair
Shiho Kim, Yonsei University (shiho@yonsei.ac.kr)
Member
Robert Chen-Hao Chang, National Chung Hsing University (chchang@dragon.nchu.edu.tw) - SoC & SP SC
Wei-Zen Chen, National Chiao Tung University (wzchen@alab.ee.nctu.edu.tw) - Wireline & Mixed SC
Utpal Desai, Intel Technology India (Utpal.Desai@Intel.com) - Digital C&S SC
Masaki Hirata, Ritsumeikan University (m-hirata@fc.ritsumei.ac.jp) - ETA SC
Po-Chiun Huang, National Tsing Hua University (pchuang@ee.nthu.edu.tw) - Analog Circuits and Systems SC
Jongsun Kim, Hongik University (js.kim@hongik.ac.kr) - Wireline & Mixed SC
Tae Wook Kim, Yonsei University (taewook.kim@yonsei.ac.kr) - RF SC
Seungjun Lee, Ewha Womans University (slee@ewha.ac.kr) - ETA SC
Bill Yang Liu, Analog Devices Shanghai (bill.liu@analog.com) - Analog Circuits and Systems SC
Leibo Liu, Tsinghua University, Beijing (liulb@tsinghua.edu.cn) - Digital C&S SC
Ting-Ping Liu, Nuvoton Electronics Technology (Shanghai) (tpliu@ieee.org) - RF SC
Zhenyu Liu, Tsinghua University (liuzhenyu73@tsinghua.edu.cn) - SoC & SP SC
Yong Moon, Soongshil Univ. (moony@ssu.ac.kr) - Data Converter SC
Koichi Ono, Sony (Koichi.Ono@jp.sony.com) - Data Converter SC